| Fabricant | Nom du produit | Type de certificat | IC Type | Date | N° certificat | |
|---|---|---|---|---|---|---|
|
GIESECKE+DEVRIENT | Convego Join F DI 5.90 (contact) | Bancontact RB 4511- General Card Spec v1.0 | S3D350A | 22 June 2022 | CAR-00139 |
|
|
GIESECKE+DEVRIENT | Convego Join F DI 5.90 (Bancontact) | Bancontact RB 4511- General Card Spec v1.0 | S3D350A | 21 June 2022 | CAR-00138 |
|
IDEMIA | Wise Fly 23 BANCONTACT 02 (CPACE-based) |
Bancontact RB 4511- General Card Spec v1.0 | SLC36PDL352 / s11 | 9 June 2022 | CAR-00137 |
|
THALES DIS | Gemalto Contactless R12 WL 20k | Bancontact RB 4511- General Card Spec v1.0 | ST31P450 / Rev.C | 31 May 2022 | CAR-00136 |
|
|
IDEMIA | Wise Fly 23 BANCONTACT 01 (MCA-based) | Bancontact RB 4511- General Card Spec v1.0 | SLC36PDL352 / s11 | 25 May 2022 | CAR-00135 |
|
|
THALES DIS | Desineo CB D20 R7 | CB Dual interface - Spécifications générales V3.0 | STM ST31P450 Rev C | 18 March 2022 |
CAR-00133 
|
|
|
IDEMIA | WISE FLY 23 | CB Dual interface - Spécifications générales V2.2 | INFINEON SLC36PDL352 | 13 December 2021 |
CAR-00129
|
|
ST Microelectronics | PRISMA CP6 v2 | Bancontact RB 4511- General Card Spec v1.0 | ST31P450 rev C | 10 March 2021 | CAR-00119 |
|
|
IDEMIA | Wise Fly 22 |
CB Dual interface - Spécifications générales V2.2 | ST31G480 Rev J | 19 February 2021 |
CAR-00117
|
|
|
THALES DIS | Optelio CL D16 R9.2 | Bancontact RB 4511- General Card Spec v1.0 | SCL32PDL400 (PURE V3.11, M/Chip Advance V7.0, Dual VSDC v6.1) |
15 January 2021 | CAR-00116 |
|
|
IDEMIA | Wise Fly 22 | CPACE Dual Interface Card Specification V1.0.0, CPACE DIC Specification Bulletin n°1 (Dec. 2019) |
ST31G480 Rev J | 23 December 2020 | CAR-00114 |
|
SELP SECURE | CPACE UNITE v1.0 | CPACE Dual Interface Card Specification V1.0.0, CPACE DIC Specification Bulletin n°1 (Dec. 2019) |
N7121 B1 | 21 December 2020 | CAR-00113 |
|
|
GIESECKE+DEVRIENT | CONVEGO JOIN F DI v5.90 | CPACE Dual Interface Card Specification V1.0.0, CPACE DIC Specification Bulletin n°1 (Dec. 2019) |
S3D350A | 18 December 2020 | CAR-00112 |
|
|
IDEMIA | Cosmo Fly v6.0 | Bancontact RB 4511- General Card Spec v1.0 | SLC32PDL348 (M/Chip Advance with Data Storage v1.2.3, M/Chip Advance v04.10.01) |
4 December 2020 | CAR-00111 |
|
|
IDEMIA | WISE FLY 22 v01.00.01 (dual Interface) | CB Dual interface - Spécifications générales V2.2 | IC:ST31G480 Rev J CB Mchip Advance 1.2.3 CB VIS 1.5.4 VCPS 2.1.3 |
2 November 2020 |
CAR-00108
|
|
GEMALTO | Clarista Contactless D16 R9.2 (Dual interface) | Bancontact General Card Spec v1.1 | SLC32PD-IFX_ECI_12h (M/Chip Advance 1.2) |
28 August 2019 | CAR-00101 |
|
|
GEMALTO | DESINEO CB D20 R6 | CB Dual interface - Spécifications générales V2.2 | IC: M7864 CB Mchip Advance 1.2 CB VIS 1.5.4 VCPS 2.1.2 |
22 May 2019 |
CAR-00096 CAR-00097
|
|
|
GIESECKE+DEVRIENT | Convego Join 5.80 (Dual interface) |
CB Dual interface - Spécifications générales V2.2 | IC: S3D350A - Rev. 2 CB Mchip Advance 1.2 CB VIS 1.5.4 VCPS 2.1.2 |
5 April 2019 |
CAR-00094 CAR-00095
|
|
|
Proton World International NV | Prisma CP5 v3b | Bancontact General Card Spec v1.1 | ST31G480 rev H | 13 August 2018 | CAR-00090 |
|
|
Proton World International NV | Prisma CP5 v2b | Bancontact General Card Spec v1.1 | ST31G480 rev H | 13 August 2018 | CAR-00091 |
|
|
Proton World International NV | Prisma CP5 v3 | Bancontact RB 4511- General Card Spec v1.0 | Prisma CP5 v3 (EMV Plus 3.1 d1) |
8 June 2018 | CAR-00087 |
|
|
IDEMIA | Solvo Evolution CB 10 (Contact Interface) | CB Dual interface - Spécifications générales V2.2 | IC: ST31H320 / OPUCE v1.0 CB-EMV (VIS 1.5) (ADVANCE 1.1) |
9 May 2018 |
CAR-00086
|
|
|
IDEMIA | Solvo Fly CB 10 (dual interface) |
CB Dual interface - Spécifications générales V2.2 | IC: ST31G480 / OPUCE v1.0 CB-EMV (VIS 1.5) (VCPS 2.1) (ADVANCE 1.1) |
4 May 2018 |
CAR-00085
|
|
|
Proton World International NV | Prisma CP5 v1 | Bancontact RB 4511- General Card Spec v1.0 | Prisma CP5 v1 (EMV Plus 4.3d v1) |
25 April 2018 | CAR-00083 |
|
|
IDEMIA | Cosmo Fly v5.8 | Bancontact RB 4511- General Card Spec v1.0 | IC: Inf v01.00.07 (ADVANCE 1.2) |
20 April 2018 | CAR-00084 |
|
|
GIESECKE+DEVRIENT | Convego Join France DI2 | CB Dual interface - Spécifications générales V2.1 | IC: NXP P60CD24 CB-EMV (VIS 1.5) (VCPS 2.1) (ADVANCE 1.1) |
11 July 2016 |
CAR-00078 CAR-00079
|
|
|
GEMALTO | DESINEO CB R5 D20 (contact interface) | CB Dual interface - Spécifications générales V2.1 | IC: Infineon M7892 G12 CB-EMV (VIS 1.5) (MCHIP) (ADVANCE 1.1) |
24 May 2016 |
CAR-00076
|
|
|
GEMALTO | DESINEO CB R5 D20 (contactless interface) | CB Dual interface - Spécifications générales V2.1 | IC: Infineon M7892 G12 CB-EMV (VCPS 2.1) (PayPass) (ADVANCE 1.1) |
24 May 2016 |
CAR-00077
|
|
OBERTHUR TECHNOLOGIES |
CB DUAL v3.4 (contact interface) | CB Dual interface - Spécifications générales V2.1 | IC: Infineon M7794 A12-G12 CB-EMV (VIS 1.5) (MCHIP) (ADVANCE 1.1) |
7 December 2015 | CAR-00072 |
|
MORPHO | EMV PRO CL CB v4.0.3 | CB Dual interface - Spécifications générales V2.1 | IC: M7892 CB-EMV (VIS 1.5) (VCPS 2.1) |
9 November 2015 |
CAR-00069 CAR-00070 |
|
|
MORPHO | EMV PRO CL CB V4.1 | CB Dual interface - Spécifications générales V2.1 | IC: M7892 CB-EMV (ADVANCE 1.1) |
16 July 2015 |
CAR-00062 CAR-00063 |
|
|
GIESECKE+DEVRIENT | Convego Join DI France | CB Dual interface - Spécifications générales V2.1 | IC: NXP P60CD24 CB-EMV (VIS 1.5) (VCPS 2.1) (ADVANCE 1.1) |
29 June 2015 |
CAR-00057 CAR-00058 |
|
|
OBERTHUR TECHNOLOGIES |
CB V3.2 (Contact) | CB Dual interface - Spécifications générales V2.1 | IC: S3FT9PE / rev 0 CB-EMV (MCHIP) (VIS 1.5) |
23 January 2015 | CAR-00056 |
|
|
MORPHO | EMV PRO CL CB v4 | CB Dual interface - Spécifications générales V2.1 | IC: M7892 CB-EMV (VIS 1.5) (VCPS 2.1) |
31 July 2014 |
CAR-00053 CAR-00054 |
|
|
GEMALTO | DESINEO CB Contactless R2 (GFCX6 – CB – Flash config. ‘M/Chip Advance 1.1) | CB Dual interface - Spécifications générales V2.1 | IC: M7892 (ADVANCE 1.0) |
3 October 2013 | CAR-00040 |
|
|
GEMALTO | DESINEO CB Contactless R2 (GFCX6 – CB – Flash config. ‘M/Chip PayPass 1.4’) | CB Dual interface - Spécifications générales V2.1 | IC: M7892 (MCHIP) (PayPass) |
19 September 2013 | CAR-00039 |
|
|
GEMALTO | DESINEO CB Contactless R2 (GFCX6 – CB – Flash config. ‘VCPS 2.1.2’) | CB Dual interface - Spécifications générales V2.1 | IC: M7892 (VIS 1.5) (VCPS 2.1) |
19 September 2013 | CAR-00041 |
|
|
OBERTHUR TECHNOLOGIES |
CB DUAL v3.0 | CB Dual interface - Spécifications générales V2.1 | IC: Infineon M7794 A12 CB-EMV (PayPass) (MCHIP) (ADVANCE 1.0) (VIS 1.5) (VCPS 2.1) |
28 June 2013 |
CAR-00037 CAR-00038 |
|
|
OBERTHUR TECHNOLOGIES |
CB Dual v2.3.1 | CB-EMV (VIS) (qVSDC) | P5CD016 | 3 August 2012 | CAR-00034 CAR-00034_c |
|
|
GEMALTO | Desineo CB R4 | CB-EMV (VIS/MCHIP) | M7892 | 24 July 2012 | CAR-00033 |
|
|
OBERTHUR TECHNOLOGIES |
CB v2.4.1 contact | CB-EMV (VIS/MCHIP) | AT90SC20812RCV | 29 May 2012 | CAR-00031 |
|
|
OBERTHUR TECHNOLOGIES |
CB v2.4 contact | CB-EMV (VIS/MCHIP) | AT90SC20812RCV | 14 February 2012 | CAR-00029 CAR-00032 |
|
|
OBERTHUR TECHNOLOGIES |
CB v2.3 contact | CB-EMV (VIS/MCHIP) | P5CD016 | 22 December 2011 | CAR-00026 CAR-00028 |
|
|
MORPHO | EMV PRO CL CB v3 | CB-EMV (VIS/MCHIP) | P5CD016 | 14 November 2011 | CAR-00025 |
|
|
MORPHO | EMV PRO CL CB v3 | CB-EMV (PayPass/qVSDC) | P5CD016 | 14 November 2011 | CAR-00025_c CAR-00030 |
|
|
OBERTHUR TECHNOLOGIES |
CB Dual v2.3 | CB-EMV (PayPass/qVSDC) | P5CD016 | 28 September 2011 | CAR-00022_c CAR-00027 |
|
|
OBERTHUR TECHNOLOGIES |
CB Dual v2.3 | CB-EMV (VIS/MCHIP) | P5CD016 | 28 September 2011 | CAR-00022 CAR-00027 |
|
|
MORPHO | EMV DDA V5.3 | CB-EMV (VIS/MCHIP) | ST23YL18 | 10 March 2011 | CAR-00018 |
|
|
OBERTHUR TECHNOLOGIES |
CB-DUAL v2.1 | CB-EMV (Mchip) (PayPass) | SLE66CLX126PE | 16 February 2011 | CAR-00017_c |
|
|
GIESECKE+DEVRIENT | Convego Element F 2.0 | CB-EMV (VIS/MCHIP) | ST23ZL18 | 27 January 2011 | CAR-00016 |
|
|
GEMALTO | DESINEO CB D12 R1 | CB-EMV (VIS/MCHIP) | P5CD081 | 8 December 2010 | CAR-00015 |
|
|
GEMALTO | DESINEO CB contactless D12 R1 | CB-EMV (PayPass/qVSDC) | P5CD081 | 8 December 2010 | CAR-00015_c CAR-00019_c CAR-00023_c |
|
|
GIESECKE+DEVRIENT | STAR DC-F 1.1 | CB-EMV (VIS/MCHIP) | SLE66CX182PE | 28 September 2010 | CAR-00003 CAR-00014 |
|
SAGEM SECURITE |
EMV DDA V5.2 | CB-EMV (VIS/MCHIP) | ST23YL18 | 8 June 2010 | CAR-00011 CAR-00012 |
|
|
SAGEM SECURITE |
EMV PRO CL v2.1 | CB-EMV (PayPass/qVSDC) | P5CD012 | 19 March 2010 | CAR-00010_c |
|
|
SAGEM SECURITE |
EMV PRO CL v2.1 | CB-EMV (VIS/MCHIP) | P5CD012 | 19 March 2010 | CAR-00010 |
|
|
SAGEM SECURITE |
EMV DDA V5 | CB-EMV (VIS/MCHIP) | ST23YL18 | 31 December 2009 | CAR-00008 |
|
|
GEMALTO | DESINEO CB D10 R3 | CB-EMV (VIS/MCHIP) | ST23YL18 | 5 October 2009 |
CAR-00007 CAR-00009 |
|
|
GEMALTO | Optelio Contactless D36 R2 | CB-EMV (MCHIP) (PayPass) | SLE66CLX360PEM | 30 September 2009 | CAR-00005 |
|
|
GEMALTO | Optelio Contactless D72 R2 | CB-EMV (VIS) (qVSDC) | SLE66CLX800PEM | 30 September 2009 | CAR-00006 |
|
|
OBERTHUR TECHNOLOGIES |
MoneytIC Chrysalis CB Fly 12RSA (CB Fly v2) | CB-EMV (VIS/MCHIP) | SLE66CLX126PE | 26 September 2009 | CAR-00004 |
|
|
OBERTHUR TECHNOLOGIES |
MoneytIC Chrysalis CB Fly 12RSA (CB Fly v2 ) | CB-EMV (PayPass/qVSDC) | SLE66CLX126PE | 26 September 2009 | CAR-00004_c |
|
|
OBERTHUR TECHNOLOGIES |
MoneytIC Chrysalis 12RSA | CB-EMV (VIS/MCHIP) | P5CC012 | 22 November 2007 | CAR-00001 |
| Industriel | Site | N° Certificat Qualité | Date Certificat Qualité | N° Certificat Sécurité | Date Certificat Sécurité | Activités | |
|---|---|---|---|---|---|---|---|
|
Euro P3C | Beaucouzé | SIQ-00316 | 14 June 2023 | SIS-00390 | 14 June 2023 | Préparation de données - Personnalisation |
|
|
Euro P3C | Mulhouse | SIQ-00315 | 17 May 2023 | SIS-00389 | 12 June 2023 | Préparation de données - Personnalisation |
|
|
GIESECKE+DEVRIENT | Craponne | SIQ-00310 | 7 April 2023 | SIS-00384 | 7 April 2023 | Préparation de données - Personnalisation |
|
|
IDEMIA | Sittard, Netherlands | SIQ-00307 | 29 March 2023 | SIS-00383 | 29 March 2023 | Personalization |
|
|
IDEMIA | Bucharest, Romania | N/A | SIS-00382 | 22 March 2023 | Personalization (Digital Card Personalization) | |
|
THALES DIS | Gémenos | SIQ-00313 | 12 April 2023 | SIS-00380 | 13 March 2023 | Encartage |
|
|
THALES DIS | Gémenos | SIQ-00312 | 12 April 2023 | SIS-00379 | 13 March 2023 | Personnalisation |
|
|
IDEMIA | Sterling, U.S.A. | N/A | SIS-00381 | 13 March 2023 | Data Preparation for digital cards | |
|
|
IDEMIA | Dijon | SIQ-00308 | 29 March 2023 | SIS-00377 | 6 March 2023 | Préparation de données - Personnalisation |
|
|
THALES DIS | Chambray-les-Tours | SIQ-00306 | 22 February 2023 | SIS-00375 | 1 March 2023 | Personalisation including data-preparation, PIN Mailing, PIN distribution via SMS and online Bank |
|
|
GIESECKE+DEVRIENT | Barcelone, Espagne | SIQ-00305 | 8 February 2023 | SIS-00373 | 7 February 2023 | Encartage |
|
|
GIESECKE+DEVRIENT | Barcelone, Espagne | SIQ-00304 | 8 February 2023 | SIS-00372 | 7 February 2023 | Fabrication de supports |
|
|
GIESECKE+DEVRIENT | Barcelone, Espagne | SIQ-00194 | 29 March 2017 | SIS-00374 | 7 February 2023 | Préparation de données - Personnalisation |
|
|
THALES DIS | Singapour | SIQ-00301 | 12 December 2022 | SIS-00371 | 31 January 2023 | Fabrication de supports |
|
|
THALES DIS | Singapour | SIQ-00300 | 12 December 2022 | SIS-00370 | 31 January 2023 | Micro-Modules / Encartage |
|
|
Thales DIS Sp z.o.o. | Tczew, Pologne | SIQ-00278 | 3 September 2021 | SIS-00368 | 20 January 2023 | Fabrication de supports |
|
|
Thales DIS Sp z.o.o. | Tczew, Pologne | SIQ-00302 | 6 January 2023 | SIS-00367 | 20 January 2023 | Encartage |
|
|
IDEMIA | Tewkesbury, UK | N/A | N/A | SIS-00365 | 22 December 2022 | PIN Distribution by SMS, PIN distribution by online bank |
|
|
IDEMIA | Ostrava, République tchèque | SIQ-00299 | 7 December 2022 | SIS-00362 | 14 December 2022 | Fabrication de supports |
|
|
IDEMIA | Ostrava, République tchèque | SIQ-00298 | 7 December 2022 | SIS-00363 | 14 December 2022 | Encartage |
|
|
IDEMIA | Vitré | SIQ-00296 | 8 November 2022 | SIS-00360 | 22 November 2022 | Encartage |
|
|
IDEMIA | Vitré | SIQ-00297 | 8 November 2022 | SIS-00359 |
22 November 2022 | Fabrication de supports |
|
|
IDEMIA | Shenzhen, China | SIQ-00292 | 28 July 2022 | SIS-00353 | 28 July 2022 | card body manufacturing |
|
|
IDEMIA | Shenzhen, China | SIQ-00293 | 28 July 2022 | SIS-00354 | 28 July 2022 | Embedding, including Pre-personalization and Micro modules manufacturing |
|
|
GIESECKE+DEVRIENT | Madrid | SIQ-00317 | 21 August 2023 | SIS-00351 | 17 June 2022 | Préparation de données - Personnalisation |
|
|
GIESECKE+DEVRIENT | Madrid, Espagne | N/A | N/A | SIS-00351 | 17 June 2022 | Card Personalisation |
|
|
IDEMIA | Baranzate (Milan), Italie | SIQ-00291 | 17 June 2022 | SIS-00350 | 14 June 2022 | Personalization (including data-preparation and PIN Mailing) |
|
|
GIESECKE+DEVRIENT | Wembley, United Kingdom | N/A | N/A | SIS-00342 | 7 February 2022 | Card Personalization |
|
|
SELP SECURE | Angoulême | SIQ-00236 | 30 January 2019 | SIS-00336 | 12 November 2021 | Fabrication de supports |
|
|
SELP SECURE | Angoulême | SIQ-00286 | 21 January 2022 | SIS-00337 | 12 November 2021 | Encartage |
|
|
GIESECKE+DEVRIENT | Markham, Canada | SIQ-00276 | 3 September 2021 | SIS-00329 | 3 September 2021 | Card Bodies Manufacturing |
|
|
GIESECKE+DEVRIENT | Markham, Canada |
SIQ-00277 | 3 September 2021 | SIS-00330 | 3 September 2021 | Embedding |
|
|
THALES DIS | Chambray les Tours | SIQ-00266 | 18 January 2021 | SIS-00306 | 18 January 2021 | Personnalisation |
|
|
IDEMIA | Baranzate (Milan), Italie | SIQ-00262 | 3 April 2020 | SIS-00298 | 8 April 2020 | Préparation de données - Personnalisation |
|
|
THALES DIS | Barcelona | N/A | SIS-00297 | 16 March 2020 | Card Personalization | |
|
|
IDEMIA | Shenzhen | SIQ-00248 | 7 June 2019 | SIS-00273 | 7 June 2019 | Fabrication de supports |
|
Credit Agricole Cards & Paiements | Champagne au Mont d’Or | SIQ-00219 | 25 January 2018 | SIS-00238 | 21 February 2018 | Préparation de données - Personnalisation |
|
|
GIESECKE+DEVRIENT | Nitra | SIQ-00184 | 24 October 2016 | SIS-00226 | 6 October 2017 | Encartage |
|
|
GIESECKE+DEVRIENT | Nitra | SIQ-00165 | 14 January 2016 | SIS-00225 | 6 October 2017 | Fabrication de supports |
|
|
MORPHO | Flintbek | SIQ-00199 | 25 April 2017 | SIS-00212 | 29 March 2017 | Encartage |
|
|
IDEMIA | Shenzhen | SIQ-00272 | 4 June 2021 | SIS-00163 | 28 March 2015 | Micro-modules |
|
NEDCARD BV | Wijchen, Pays-Bas | SIQ-00271 | 4 June 2021 | SIS-00158 | 28 January 2015 | Micro-modules |
| SYSCOM (IDEMIA) | Noida, India | SIQ-00244 | 5 June 2019 | N/A | N/A | Fabrication de supports | |
| SYSCOM (IDEMIA) | Noida, India | SIQ-00245 | 5 June 2019 | N/A | N/A | Encartage | |
|
Linxens | Singapore | SIQ-00303 | 25 January 2023 | N/A | N/A | Micromodules Manufacturing |
Ce logo signifie
que le produit
est certifié sous
accréditation COFRAC
Accréditation n°5-0563
portée disponible sur
www.cofrac.fr
